HiSilicon (, ) è una azienda di semiconduttori fabless cinese con sede a Shenzhen, Cina; è interamente posseduta da Huawei.
HiSilicon ha acquisito licenze da ARM Holdings per almeno i seguenti core: ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, 02 August 2011 on ARM.com ARM Cortex-A53, ARM Cortex-A57 e anche per la GPU Mali-T628 MP4.ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors on ARM.com HiSilicon ha anche acquisito licenze da Vivante Corporation per il loro motore grafico GC4000. Viene ritenuta il più grande progettista di circuiti integrati della Cina. Produce i system-on-a-chip "KIRIN" e "K3".
Prodotti K3V1 Model Number Fab CPU GPU Memory Technology GPS wireless Disponibile da Dispositivi Instruction set Microarchitettura Cores Frq (MHz) Microarchitettura Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN K3V1 (Hi3611) 130 nm ARMv5 ARM9E 1 800 2009 Babiken Vefone V1, Ciphone 5 (C5), T5355, IHTC HD-2, 5-inch Huawei UMPC
K3V2 Il primo prodotto conosciuto di HiSilicon è il K3V2 usato nello smartphone Huawei Ascend D Quad XL (U9510)brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net e nel tablet Huawei MediaPad 10 FHD7.Huawei introduces quad-core 10 inch tablet with 1080p display on Liliputing.com Questo chipset è basato su l'ARM Cortex-A9 MPCore fabbricato a 40 nm ed usa la GPU Vivante GC4000 GPU a 16 core.Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on AnandTech Il SoC supporta LPDDR2-1066, ma i prodotti effettivamente realizzati usano invece l'LPDDR-900 per avere un basso consumo di corrente.
Model Number Fab CPU GPU Memory Technology GPS wireless Disponibile da Dispositivi Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN K3V2 (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 480 MHz, 30.7 GFLOPS LPDDR2 64-bit dual-channel 7.2 (up to 8.5) 2012Huawei MediaPad 10 FHD, Huawei Ascend D2 (U9510), Huawei Honor 2 (U9508), Huawei Ascend P6S, Huawei Ascend P2, Huawei Ascend Mate, Lenovo A376, STREAM X (GSL07S))
K3V2E
Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN K3V2E 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 480 MHz, 30.7 GFLOPS LPDDR2 64-bit dual-channel 7.2 (up to 8.5) 2013 Huawei Honor 3
KIRIN 620 • supporta - USB2 / 13MP / Codifica video 1080P
Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN KIRIN 620 28 nm ARMv8-A Cortex-A53 8 1.2 GHz (A53) Mali-450 MP4 700 MHz LPDDR3 ( MHz) 64-bit dual-channel 12.8 DUAL SIM LTE Cat.4 (150 Mbit/s) Q1 2015 Huawei P8 Lite, Huawei X4, Huawei Honor 4C
KIRIN 910 Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN KIRIN 910 28 nm HPM ARMv7 Cortex-A9 4 1.6 ARM Mali-450 MP4 533 MHz LPDDR3 32-bit single-channel 6.4 LTE Cat.4 H1 2014 HP Slate 7 VoiceTab Ultra, Huawei MediaPad X1, Huawei P6 S, Huawei MediaPad M1, Huawei Honor 3C 4G KIRIN 910T 1.8 700 MHz LPDDR3 32-bit single-channel 6.4 LTE Cat.4 H1 2014 Huawei Ascend P7
KIRIN 920 • Il SoC KIRIN 920 contiene anche un processore di immagini che supporta fino a 32 Megapixel
Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN KIRIN 920 28 nm HPM ARMv7 Cortex-A15Cortex-A7big.LITTLE 4+4 1.7 GHz (A15)1.3 GHz (A7) Mali-T624 MP4 600 MHz LPDDR3 (1600 MHz) 32-bit dual-channel 12.8 LTE Cat.6 (300 Mbit/s) H2 2014Huawei Honor 6 KIRIN 925 28 nm HPM ARMv7 Cortex-A15Cortex-A7big.LITTLE 4+4 1.8 GHz (A15)1.3 GHz (A7) Mali-T628 MP4 LPDDR3 (1600 MHz) 32-bit dual-channel 12.8 LTE Cat.6 (300 Mbit/s) Q3 2014 Huawei Ascend Mate7, Huawei Honor 6 Plus
KIRIN 930 • supporta - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-Band a/b/g/n WI_FI / BT 4.0 Low Energy / USB2 / 32MP ISP / Codifica video 1080P
Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN KIRIN 930 28 nm HPM ARMv8-A Cortex-A53eCortex-A53big.LITTLE 4+4 2.0 GHz (A53e)1.5 GHz (A53) Mali-T628 MP4 LPDDR3 (1600 MHz) 64-bit dual-channel 12.8 DUAL SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) Q1 2015 Huawei MediaPad X2, Huawei P8 KIRIN 935 28 nm HPM ARMv8-A Cortex-A53eCortex-A53big.LITTLE 4+4 2.2 GHz (A53e)1.5 GHz (A53) Mali-T628 MP4 LPDDR3 (1600 MHz) 64-bit dual-channel 12.8 DUAL SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) Q1 2015 Huawei Honor 7, Huawei P8 MAX, Huawei Mate S
KIRIN 940 • supporta - SD 4.1 (UHS-I) / eMMC 5.1 / MU-MIMO ac WI_FI / BT 4.2 Smart / USB3.0 / 32MP ISP / Codifica video 4K
Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN KIRIN 940 16 nm FinFET Plus ARMv8-A Cortex-A72Cortex-A53big.LITTLE 4+4 2.2 GHz (A72)1.5 GHz (A53) Mali-T860 LPDDR4 64-bit dual-channel 12.8 DUAL SIM LTE Cat.7 (DL:300 Mbit/s UP:100 Mbit/s) Q3 2015
KIRIN 950 • supporta: - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Codifica video 10-bit 4K nativa / coprocessore i5 / Tensilica HiFi 4 DSP
Modello Fab CPU GPU Tecnologia memoria Nav wireless Disponibile da Dispositivi Instruction set Microarchitettura Core Frq (GHz) Microarchitettura Frq (MHz) Tipo Larghezza Bus (bit) Banda (GB/s) Reti cellulare WLAN PAN KIRIN 950 16 nm FinFET Plus ARMv8-A Cortex-A72Cortex-A53big.LITTLE 4+4 2.3 GHz (A72)1.8 GHz (A53) Mali-T880 MP4900 MHz(122.4GFlops) LPDDR4 64-bit dual-channel 25.6GB/s DUAL SIM LTE Cat.10 (DL:450 Mbit/s UP:100 Mbit/s) Q4 2015 Huawei Mate 8, Honor 8, Honor V8 (KNT-AL10, KNT-TL10) Kirin 955 16 nm FinFET Plus ARMv8-A Cortex-A72Cortex-A53big.LITTLE 4+4 2.5 GHz (4 × A72)1.8 GHz (4 × A53) Mali-T880 MP4 900 MHz(122.4GFlops) LPDDR3(3 GB) LPDDR4 (4 GB) 64-bit dual-channel 25.6 GB/s Dual SIM LTE Cat.6 Q2 2016 Huawei P9, Huawei P9 Plus, Honor V8 (KNT-AL20), Honor Note 8
Kirin 960
Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1
Modello Fab CPU GPU Tecnologia memoria Nav wireless Disponibile da Dispositivi Instruction set Microarchitettura Core Frq (GHz) Microarchitettura Frq (MHz) Tipo Larghezza Bus (bit) Banda (GB/s) Reti cellulare WLAN PAN Kirin 960 TSMC 16 nm FFC ARMv8-A Cortex-A73Cortex-A53big.LITTLE 4+4 2.362 (A73)1.844 (A53) Mali-G71 MP8 1037 MHz (282GFlops) LPDDR4-1800 64-bit(2x32-bit) Dual-channel 29.8 Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO Q4 2016 Huawei Mate 9, Huawei Mate 9 Porsche Design, Huawei Mate 9 Pro, Honor V9, Huawei P10, Huawei P10 Plus, Honor 8 pro, Honor 9
Piattaforme similari A-Serie di Allwinner Apple Silicon di Apple Atom di Intel i.MX di Freescale MT di MediaTek NovaThor di ST-Ericsson OMAP di Texas Instruments RK di Rockchip R-Car di Renesas Snapdragon di Qualcomm Tegra di Nvidia
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Categoria:Aziende sussidiarie della Huawei